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AI Technology has more than 29 years experience in designing and manufacturing various forms of high performance “Stress-free” flexible adhesive films and pastes and materials for microelectronic packaging and thermal interface materials for thermal management applications. Our newest research has yielded higher performance and lower cost, solderable flexible circuit substrate materials to replace polyimide-based organic copper-clad laminates in high frequency, RFID, and with low dielectric constant loss and low moisture absorption in replacing PTFE substrate material in microwave circuits. Our technologies and products include solvent-free dies and substrate attach pastes and films, compressible gap-filling phase change thermal interface materials of thermal pads, thermal gels, thermal greases, polymer based Solder-Sub® flexible conductive adhesives for solder-replacement in fine-pitch interconnections, near-hermetic lid sealant for ceramic and metal covers and optical glass lids for opto-electronic sensors and devices, EMI Shielding gasket/adhesive/caulk materials, double-sided UV-release wafer grinding tapes and high temperature-static free dicing tapes.

OUR HISTORY

Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging. AI Technology now has one of the highest reliability adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing die-attach film (DDAF), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230°C. The company continues to provide the adhesive solution for component and substrate bonding for both military and commercial applications. Its thermal interface material solutions of patented phase-change thermal pads, thermal greases and gels and thermal adhesives set many bench marks of performance and reliability for power semiconductors, modules, computers and communication electronics.

The company has an ISO9001:2008 certified manufacturing and R&D facility in the U.S. and a Far East Center in Hong Kong. The US headquarters has more than 50,000 square feet of manufacturing facilities for its die and substrate attached adhesive films and pastes, thermal interface materials (TIM) including insulated metal substrates, gap-filling compressible phase-change pads, thermal gels, thermal greases and adhesive films and pastes. AI Technology provides electromagnetic and radio frequency interference (EMI/RFI) mitigation material solutions including conductive gaskets, form-in-place (FIP) conductive gaskets, self-attached shielding covers/cans/lids, conductive caulks and adhesives, ultra-high temperature (300°C) continuous use films and paste die and component adhesives and advanced organic copper-clad laminates from 1/4 oz to 1 oz copper within its 16-acre campus in Princeton Junction, NJ.

AIT application engineering, sales, chemists, and material scientists are ready to design and manufacture to your application’s requirements and specifications. Please inform us of your requirements using the Contact tab or click on the button below:

AIT sales and product support:
1-609-799-9388
Fax: 609-799-9308